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Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components pictures & photos
Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components pictures & photos
Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components pictures & photos
Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components pictures & photos
Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components pictures & photos
Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components pictures & photos
  • Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components
  • Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components
  • Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components
  • Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components
  • Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components
  • Printed Circuit Board Assembly Multi-Layer PCB with Densely Packed Electronic Components
Metal Coating: Copper
Mode of Production: SMT+DIP
Layers: Double-Layer
Base Material: FR-4
Certification: RoHS, CCC, ISO
Customized: Customized
Samples:
US$ 30/Piece 1 Piece(Min.Order)
| Request Sample
Customization:

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